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Electroless Deposition And Electrical Resistivity Of Sub-100nm Cu Films On SAMs: State Of The Art

E. Glickman, A. Inberg, N. Fishelson, Y. Shaham-Diamand
Published 2007 · Materials Science

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Self-assembled organic monolayers (SAMs) of silanes with -SH, -NH"2 and -C"5H"4N functional groups have been shown recently to act as ultra-thin, robust diffusion barriers at the Cu/SiO"2 and Cu/ultra low-k dielectric interfaces. More generally, SAMs with their tunable surface chemistry are essential elements of future all-wet ULSI metallization with Cu deposited by electroless (ELD) over SAM-functionalized dielectrics. Far too small is known however on the electrical properties of thin metal films formed onto SAM/dielectric substrates. In this paper, we give first a brief literature survey of what is known about Cu films deposited by electroless over dielectrics modified by SAMs. Second, we present our observations of electrical resistivity @r of sub-100nm ELD Cu films deposited over the surface of amino-silane SAM/SiO"2 activated by Au monodispersed nano-particles and show that this techniques helps to obtain considerably smaller @r compared to the previously reported data.
This paper references
Controlled Nucleation for the Regulation of the Particle Size in Monodisperse Gold Suspensions
G. Frens (1973)
Local density of states effects at the metal-molecule interfaces in a molecular device
H. Boyen (2006)
Amino-terminated self-assembled monolayer on a SiO2 surface formed by chemical vapor deposition
A. Hozumi (2001)
Seedless micropatterning of copper by electroless deposition on self-assembled monolayers
P. Zhu (2004)
Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits
G. Ramanath (2003)
Self-assembled monolayers as Cu diffusion barriers for ultralow-k dielectrics
B. R. Murthy (2006)
Self-assembled near-zero-thickness molecular layers as diffusion barriers for Cu metallization
G. Ramanath (2001)
The Materials Science of Thin Films
M. Ohring (1991)
Metal deposition onto a thiol-covered gold surface : A new approach
V. Ivanova (2005)
Metal deposition onto thiol-covered gold: Platinum on a 4-mercaptopyridine SAM
M. Manolova (2005)
Micropatterning of copper on a poly(ethylene terephthalate) substrate modified with a self-assembled monolayer.
S. Sawada (2006)
Diffusion barrier properties of carboxyl- and amine-terminated molecular nanolayers
P. G. Ganesan (2004)
Robust self-assembled monolayer as diffusion barrier for copper metallization
N. Mikami (2003)
Integrated electroless metallization for ULSI
Y. Shacham-Diamand (1999)

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