Online citations, reference lists, and bibliographies.
← Back to Search

Electroless Deposition And Electrical Resistivity Of Sub-100nm Cu Films On SAMs: State Of The Art

E. Glickman, A. Inberg, N. Fishelson, Y. Shaham-Diamand
Published 2007 · Materials Science

Cite This
Download PDF
Analyze on Scholarcy
Share
Self-assembled organic monolayers (SAMs) of silanes with -SH, -NH"2 and -C"5H"4N functional groups have been shown recently to act as ultra-thin, robust diffusion barriers at the Cu/SiO"2 and Cu/ultra low-k dielectric interfaces. More generally, SAMs with their tunable surface chemistry are essential elements of future all-wet ULSI metallization with Cu deposited by electroless (ELD) over SAM-functionalized dielectrics. Far too small is known however on the electrical properties of thin metal films formed onto SAM/dielectric substrates. In this paper, we give first a brief literature survey of what is known about Cu films deposited by electroless over dielectrics modified by SAMs. Second, we present our observations of electrical resistivity @r of sub-100nm ELD Cu films deposited over the surface of amino-silane SAM/SiO"2 activated by Au monodispersed nano-particles and show that this techniques helps to obtain considerably smaller @r compared to the previously reported data.
This paper references
10.1038/PHYSCI241020A0
Controlled Nucleation for the Regulation of the Particle Size in Monodisperse Gold Suspensions
G. Frens (1973)
10.1038/NMAT1607
Local density of states effects at the metal-molecule interfaces in a molecular device
H. Boyen (2006)
10.1116/1.1336833
Amino-terminated self-assembled monolayer on a SiO2 surface formed by chemical vapor deposition
A. Hozumi (2001)
10.1039/B311061C
Seedless micropatterning of copper by electroless deposition on self-assembled monolayers
P. Zhu (2004)
10.1063/1.1591232
Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits
G. Ramanath (2003)
10.1149/1.2201988
Self-assembled monolayers as Cu diffusion barriers for ultralow-k dielectrics
B. R. Murthy (2006)
10.1063/1.1365418
Self-assembled near-zero-thickness molecular layers as diffusion barriers for Cu metallization
G. Ramanath (2001)
10.5860/choice.30-0953
The Materials Science of Thin Films
M. Ohring (1991)
10.1016/J.ELECTACTA.2005.05.047
Metal deposition onto a thiol-covered gold surface : A new approach
V. Ivanova (2005)
10.1016/J.SUSC.2005.06.005
Metal deposition onto thiol-covered gold: Platinum on a 4-mercaptopyridine SAM
M. Manolova (2005)
10.1021/LA051538R
Micropatterning of copper on a poly(ethylene terephthalate) substrate modified with a self-assembled monolayer.
S. Sawada (2006)
10.1063/1.1775035
Diffusion barrier properties of carboxyl- and amine-terminated molecular nanolayers
P. G. Ganesan (2004)
10.1063/1.1635665
Robust self-assembled monolayer as diffusion barrier for copper metallization
N. Mikami (2003)
10.1016/S0013-4686(99)00067-5
Integrated electroless metallization for ULSI
Y. Shacham-Diamand (1999)



This paper is referenced by
10.1109/3DIC.2010.5751438
All-wet fabrication technology for high aspect ratio TSV using electroless barrier and seed layers
F. Inoue (2010)
10.1149/1.3258026
Materials Engineering for Future Interconnects: “Catalyst-Free” Electroless Cu Deposition on Self-Assembled Monolayer Alternative Barriers
S. Armini (2010)
10.1016/J.APSUSC.2009.06.043
Introduction of amino groups on the surface of thin photo definable epoxy resin layers via chemical modification
David Schaubroeck (2009)
10.1016/J.SURFCOAT.2009.08.028
Electrical properties of sub-100 nm Cu films deposited by electroless plating on amino-terminated silicon oxide activated with Au nano-particles
A. Inberg (2009)
10.1002/SIA.5156
Electroless plating of copper on fly ash cenospheres using polyaniline‐Pd activation
W. Wang (2013)
10.1016/J.ELECTACTA.2009.02.089
Formation and characterization of low resistivity sub-100 nm copper films deposited by electroless on SAM
T. Asher (2009)
10.1016/J.COMPSCITECH.2012.02.012
Electromagnetic interference shielding, mechanical properties and water absorption of copper/bamboo fabric (Cu/BF) composites
Yinxiang Lu (2012)
10.1109/3DIC.2015.7334609
All-wet TSV filling with highly adhesive displacement plated Cu seed layer
K. Ohta (2015)
Surfaces de silice fonctionnalisées par voie CO2 supercritique : effets du confinement et comportement en solution aqueuse
Susana Sananes israel (2018)
10.1016/J.COLSURFA.2012.09.045
Site-selective electroless plating of copper on a poly(ethylene terephthalate) surface modified with a self-assembled monolayer
Jiali Cao (2012)
10.1016/J.APSUSC.2012.04.072
Precipitation of gold nanoparticles on insulating surfaces for metallic ultra-thin film electroless deposition assistance
P. Livshits (2012)
10.1016/J.ELECTACTA.2011.02.078
Formation of electroless barrier and seed layers in a high aspect ratio through-Si vias using Au nanoparticle catalyst for all-wet Cu filling technology
F. Inoue (2011)
10.1557/PROC-1156-D04-08
Electroless Cu deposition on self-assembled monolayer alternative barriers
Silvia Armini (2009)
10.1016/J.SURFCOAT.2014.04.041
Thin electroless Co(W,P) film growth on titanium–nitride layer modified by self-assembled monolayer
M. Malki (2014)
10.1016/J.SUPFLU.2009.08.008
Alkoxysilane layers deposited by SC CO2 process on silicon oxide for microelectronics applications
D. Rébiscoul (2009)
10.1007/s13391-013-0051-z
Effect of pre-cleaning treatment and contact wetting angle in the interface between P-doped Si surfaces and selective solar cell electrodes
Y. Cui (2013)
10.1016/J.ELECTACTA.2013.05.015
Silver nanometer-scale thin films by electroless deposition on insulating surfaces activated by gold nanoparticles
A. Inberg (2013)
10.1016/J.APSUSC.2009.11.012
Complete filling of 41 nm trench pattern using Cu seed layer deposited by SAM-modified electroless plating and electron-beam evaporation
W. K. Han (2010)
10.1016/j.jcis.2014.12.059
Synthesis of buoyant metal-coated fly ash cenosphere and its excellent catalytic performance in dye degradation.
W. Wang (2015)
Formation of Aminosilane and Thiol Monolayers on Semiconductor Surfaces and Bulk Wet Etching of III--V Semiconductors
Rahul Jain (2012)
10.1149/2.038312JES
Hybrid Method for Metallization of Glass Interposers
P. Ogutu (2013)
10.1021/acsami.6b11058
Hierarchical Self-Assembly of Cu7Te5 Nanorods into Superstructures with Enhanced SERS Performance.
Jiaojiao Zheng (2016)
10.1039/c5cp02291f
Electrochemical growth of CoNi and Pt-CoNi soft magnetic composites on an alkanethiol monolayer-modified ITO substrate.
D. Escalera-López (2015)
10.1149/2.0061702JES
Direct Electrodeposition of Thin Metal Films on Functionalized Dielectric Layer and Hydrogen Gas Sensor
J. Lee (2017)
10.3139/146.110945
Copper/bamboo fabric composite prepared via a silver catalytic electroless deposition process for electromagnetic shielding
Q. Liang (2013)
10.1063/1.3076115
Toward metal-organic insulator-semiconductor solar cells, based on molecular monolayer self-assembly on n-Si
Rotem Har-lavan (2009)
10.1016/J.ELECTACTA.2012.04.165
Adsorption of Pd nanoparticles catalyst in high aspect ratio through-Si vias for electroless deposition
F. Inoue (2012)
10.1143/JJAP.50.05ED01
Formation and Evaluation of Electroless-Plated Barrier Films for High-Aspect-Ratio Through-Si Vias
H. Miyake (2011)
10.1016/J.MOLCATA.2011.07.016
Enantioselective hydrogenation of 1-phenyl-propane-1,2-dione on immobilised cinchonidine Pt/SiO2 catalysts
C. Campos (2011)
Semantic Scholar Logo Some data provided by SemanticScholar