Online citations, reference lists, and bibliographies.
Please confirm you are human
(Sign Up for free to never see this)
← Back to Search

Simulations Of An Interface Crack Nucleation During Nanoindentaion : Molecular Dynamics And Finite Element Coupling Approach

S. Hara, S. Izumi, Shinsuke Sakai, Y. Eguchi, T. Iwasaki
Published 2008 · Materials Science

Save to my Library
Download PDF
Analyze on Scholarcy
We carried out the nanoindentation simulations for the Ru (superlayer) / Cu (film) / SiO2 (substrate) system using the finite temperature MD-FEM coupling method. The calculations are performed for the different adhesion energies of Cu/SiO2 ranging from 0.2 to 0.6 J/m 2 . During loading, it was found that the interfacial crack nucleation occurs at three to four times the contact radius, driven by the tensile stress acted on the Cu/SiO2 interface. We also show that the asymmetric defect behavior have a great effect on giving birth to the crack nucleation. The observation of our simulation indicates that the mechanism of the crack nucleation strongly depends on the interfacial bonding energy.
This paper references
A finite-temperature dynamic coupled atomistic/discrete dislocation method
S. Qu (2005)
Atomic scale structure of sputtered metal multilayers
X. Zhou (2001)
Crack propagation in b.c.c. crystals studied with a combined finite-element and atomistic model
S. Kohlhoff (1991)
Misfit-energy-increasing dislocations in vapor-deposited CoFe/NiFe multilayers
Xiaowang Zhou (2004)
Seguin Hen (1824)
Interfacial toughness measurements for thin films on substrates
A. Volinsky (2002)
Atomic-scale modelling of plasticity at a metal film/amorphous substrate interface
D. Rodney (2005)
Fast parallel algorithms for short-range molecular dynamics
S. Plimpton (1993)
Measurement of adherence of residually stressed thin films by indentation. I. Mechanics of interface delamination
D. Marshall (1984)
Modelling Simul
X. W. Zhou (2001)
Modelling Simul
M. Verdier (1995)
C. L. Kelchne (1108)
Quantitative adhesion measures of multilayer films: Part II. Indentation of W/Cu, W/W, Cr/W
M. Kriese (1999)
Quantifying the early stages of plasticity through nanoscale experiments and simulations
K. Vliet (2003)
Dislocation nucleation and defect structure during surface indentation
C. L. Kelchner (1998)
Molecular dynamics study of adhesion strength and diffusion at interfaces between interconnect materials and underlay materials
T. Iwasaki (2000)
Quantitative adhesion measures of multilayer films: Part I. Indentation mechanics
M. Kriese (1999)

This paper is referenced by
Semantic Scholar Logo Some data provided by SemanticScholar