Online citations, reference lists, and bibliographies.
← Back to Search

Influence Of Organic Additives On Electrodeposition Of Co–Cu Alloys From Sulphate Bath

L. Mentar, M. Khelladi, A. Azizi, A. Kahoul
Published 2012 · Materials Science

Save to my Library
Download PDF
Analyze on Scholarcy
Abstract In this work, the authors report on the influence of additives on the onset of deposition, the current efficiency (CE) and the nucleation growth mechanism of Co–Cu alloys electrodeposited on n-Si(100) substrate from sulphate solution with an addition of sodium citrate (SC) and citric acid (CA). The study was carried out by means of cyclic voltammetry, chronoamperometry methods using the Scharifker–Hills model for the determination of nucleation and growth mechanism and some kinetic parameters for nucleation. The CV curves indicate that the deposition potential of Cu(II) is shifted to more negative potentials while additive anion is added in the solution. Also, the results show that the additives do not improve the CE. For all baths, electrodeposited Co–Cu alloy follows instantaneous nucleation and three-dimensional (3D) diffusion limited growth. The nucleation density in the solutions without additive and with SC increases exponentially with the potential whereas in solution containing CA additive, it is no longer possible to consider exponential increase, indicating the existence of a reaction in addition to the 3D nucleation mechanism in the Co–Cu electrodeposition process.
This paper references
Electrodeposition of Granular Cu-Co Alloys
T. Cohen-Hyams (2003)
Y. Chen (2008)
Preparation of Cu-Co Alloy Thin Films on n-Si by Galvanostatic DC Electrodeposition
G. Pattanaik (2002)
in: ‘Modern aspects of electrochemistry’, (ed
R. Sonnenfeld (1990)
Additive Effects during Pulsed Deposition of Cu‐Co Nanostructures
J. Kelly (2000)
Electrodeposition: The Materials Science of Coatings and Substrates
J. Dini (1993)
Electrochemical nucleation: Part I. General considerations
G. Gunawardena (1982)
B. R. Scharifker (1983)
Modern aspects of
R Sonnenfeld (1990)
Theoretical and experimental studies of multiple nucleation
B. Scharifker (1983)
Towards Flexible Magnetoelectronics: Buffer‐Enhanced and Mechanically Tunable GMR of Co/Cu Multilayers on Plastic Substrates
Y. Chen (2008)
Property changes of electroplated Cu/Co alloys and multilayers by organic additives
K. Hong (2006)
G.G. Stokes (1890)
Annealing of Electroplated Co-Cu Films to Induce Magnetoresistance
E. Gómez (2004)
The properties of electrodeposited metals and alloys
William H. Safranek (1986)
Influence of Additives on Nucleation and Growth of Copper on n-Si(111) from Acidic Sulfate Solutions
A. Radisic (2002)
in: ‘Electrodeposition technology, theory and practice’, (ed
M. Paunovic (1987)
Electrodeposition technology, theory and
M Paunovic (1987)
Electroplating of a Co–Cu alloy from a citrate bath containing boric acid
S. A. A. El-rehim (2000)
Influence of Crystalline Structure and Sulfur Inclusion on Corrosion Properties of Electrodeposited CoNiFe Soft Magnetic Films
T. Osaka (1999)
Effect of Organic Additives on the Electrocrystallization and the Magnetoresistance of Cu-Co Multilayers
E. Chassaing (2001)
Modern Aspects of Electrochemistry
B. E. Conway (1971)
Q. Liu (2005)
Morphology and structure of nickel nuclei as a function of the conditions of electrodeposition
E. Gómez (1995)
Initial stages of the electrocrystallization of Co–Cu alloys on GCE from the Co rich electrolytes
M. Gu (2007)
M. Gu (2007)
Chang, P
J. Horkans (1991)
Determination of Partial Currents for CuNi and CuCo Electrodeposition Using Rotating Ring‐Disk Electrodes
J. Horkans (1991)

This paper is referenced by
Semantic Scholar Logo Some data provided by SemanticScholar